We manufacture a wide range of window clamp of various brand wire-bonder such as ASM, ESEC, KNS, Kaijo and etc. We use computer-aided process system for manufacturing window clamps that used in the semiconductor industries.

We specialize in producing spring plate type window clamp, which has proved useful by the following product : TQFP, SOT 23, SC 70, MSOP, SOIC, TO 220, etc.

Advantages of the wire-bond spring plate clamp design include improved clamping capability, universal spring plate for various similar package model applications, maintenance and cost reduction.

Improved Spring Plate Clamping Capability

• Spring plate design with flex effect
• Capable of clamping up to 25µm uneven surface

Universal Spring Plate for Various Similar Package Model Applications

• Universal base plate design for similar packages
• Similar device spring plate can be use on different wire-bonder models with universal base plate

Our products on window clamp shown on next page.